NSN 5962-01-317-3180 (5962013173180) Microcircuit Memory Parts List

Alternative NSN: 5962-01-317-3180

FSG: 59 Electrical and Electronic Equipment Components

Federal Supply Class (FSC): 5962 Microcircuits Electronic

NCB Code: USA (01)

Manufacturers: Integrated Device Technology Inc

ASAP Aerospace, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Customers can easily search our database to find NSN parts like Microcircuit Memory IDT7130LA100CB of Integrated Device Technology Inc with NSN 5962-01-317-3180.

NSN 5962-01-317-3180, National Stock Number, is a 13-digit serial number assigned by the US DLA to an item that is bought, stored, and sold via the federal supply chain. Unlike part numbers, NSNs are not arbitrary and follow a specific classification system.

Part Number List for NSN 5962013173180

Part No	Item Name	Manufacturer	QTY	RFQ
IDT7130LA100CB	Microcircuit Memory	Integrated Device Technology Inc	Avl	RFQ

Characteristics Data of NSN 5962013173180

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	2.370 INCHES MINIMUM AND 2.430 INCHES MAXIMUM
ADAT	BODY WIDTH	0.550 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
AFJQ	STORAGE TEMP RANGE	-65.0 TO 150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	LOW POWER AND HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND W/ENABLE AND BIDIRECTIONAL
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	44 INPUT
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CZER	MEMORY DEVICE TYPE	RAM
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQY	TERMINAL TYPE AND QUANTITY	48 PRINTED CIRCUIT
ADAU	BODY HEIGHT	0.030 INCHES MINIMUM AND 0.170 INCHES MAXIMUM
CZEQ	TIME RATING PER CHACTERISTIC	100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
AFGA	OPERATING TEMP RANGE	-55.0 TO 125.0 DEG CELSIUS
CQSJ	INCLOSURE MATERIAL	CERAMIC

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