NSN 5962-01-108-4110 (5962011084110) Microcircuit Memory Parts List

Alternative NSN: 5962-01-108-4110

FSG: 59 Electrical and Electronic Equipment Components

Federal Supply Class (FSC): 5962 Microcircuits Electronic

NCB Code: USA (01)

Manufacturers: Advanced Micro Devices Inc , Intersil Corporation , Mmi Amd , Rockwell Collins Inc , Texas Instruments Incorporated

ASAP Aerospace, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Customers can easily search our database to find NSN parts like Microcircuit Memory 351-7769-280, 5301-1J 7769-280, AM27S11DM 7769-280, HM1-7611-2 7769-280, SN54S287J 7769-280 of Rockwell Collins Inc, Mmi Amd, Advanced Micro Devices Inc, Intersil Corporation, Texas Instruments Incorporated with NSN 5962-01-108-4110.

NSN 5962-01-108-4110, National Stock Number, is a 13-digit serial number assigned by the US DLA to an item that is bought, stored, and sold via the federal supply chain. Unlike part numbers, NSNs are not arbitrary and follow a specific classification system.

Part Number List for NSN 5962011084110

Part No	Item Name	Manufacturer	QTY	RFQ
351-7769-280	Microcircuit Memory	Rockwell Collins Inc	Avl	RFQ
5301-1J 7769-280	Microcircuit Memory	Mmi Amd	Avl	RFQ
AM27S11DM 7769-280	Microcircuit Memory	Advanced Micro Devices Inc	Avl	RFQ
HM1-7611-2 7769-280	Microcircuit Memory	Intersil Corporation	Avl	RFQ
SN54S287J 7769-280	Microcircuit Memory	Texas Instruments Incorporated	Avl	RFQ

Characteristics Data of NSN 5962011084110

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM
ADAT	BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	512.0 MILLIWATTS
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	10 INPUT
CTFT	CASE OUTLINE SOURCE AND DESIGNATOR	MO-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
CZER	MEMORY DEVICE TYPE	ROM
CZZZ	MEMORY CAPACITY	UNKNOWN
TEST	TEST DATA DOCUMENT	13499-351-7769 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA
TTQY	TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT

Similar NSN of 5962011084110

5905-00-000-0136	5905-00-001-2573	5905-00-001-2813
5905-00-001-2852	5905-00-001-2882	5905-00-001-2890
5905-00-001-2934	5905-00-001-2951	5905-00-001-2952