NSN 5962-01-075-7608 (5962010757608) Microcircuit Memory Parts List

Alternative NSN: 5962-01-075-7608

FSG: 59 Electrical and Electronic Equipment Components

Federal Supply Class (FSC): 5962 Microcircuits Electronic

NCB Code: USA (01)

Manufacturers: Dla Land And Maritime , Intersil Corporation , Mmi Amd , Philips Semiconductors Inc , Raytheon Company , Sri International , Texas Instruments Incorporated

ASAP Aerospace, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Customers can easily search our database to find NSN parts like Microcircuit Memory 17763, 82S129W, 932820-212, B2054-212, CC5193-212 of Mmi Amd, Philips Semiconductors Inc, Raytheon Company, Intersil Corporation, Sri International with NSN 5962-01-075-7608.

NSN 5962-01-075-7608, National Stock Number, is a 13-digit serial number assigned by the US DLA to an item that is bought, stored, and sold via the federal supply chain. Unlike part numbers, NSNs are not arbitrary and follow a specific classification system.

Part Number List for NSN 5962010757608

Part No	Item Name	Manufacturer	QTY	RFQ
17763	Microcircuit Memory	Mmi Amd	Avl	RFQ
82S129W	Microcircuit Memory	Philips Semiconductors Inc	Avl	RFQ
932820-212	Microcircuit Memory	Raytheon Company	Avl	RFQ
B2054-212	Microcircuit Memory	Intersil Corporation	Avl	RFQ
CC5193-212	Microcircuit Memory	Philips Semiconductors Inc	Avl	RFQ
GEM05601BFA	Microcircuit Memory	Sri International	Avl	RFQ
HM9-7611-2	Microcircuit Memory	Intersil Corporation	Avl	RFQ
MM5301-1F	Microcircuit Memory	Mmi Amd	Avl	RFQ
ROM PROM FAMILY 015	Microcircuit Memory	Dla Land And Maritime	Avl	RFQ
SN54S287W	Microcircuit Memory	Texas Instruments Incorporated	Avl	RFQ

Characteristics Data of NSN 5962010757608

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.440 INCHES MAXIMUM
ADAT	BODY WIDTH	0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.085 INCHES MAXIMUM
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE AND PROGRAMMED AND SCHOTTKY AND BIPOLAR AND 3-STATE OUTPUT
CQSJ	INCLOSURE MATERIAL	CERAMIC AND GLASS
CQSZ	INCLOSURE CONFIGURATION	FLAT PACK
CQWX	OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	10 INPUT
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	5.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 89.0
CZER	MEMORY DEVICE TYPE	ROM
TEST	TEST DATA DOCUMENT	82577-932820 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQY	TERMINAL TYPE AND QUANTITY	16 FLAT LEADS

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