NSN 5962-01-139-3212 (5962011393212) Microcircuit Memory Parts List

Alternative NSN: 5962-01-139-3212

FSG: 59 Electrical and Electronic Equipment Components

Federal Supply Class (FSC): 5962 Microcircuits Electronic

NCB Code: USA (01)

Manufacturers: Dla Land And Maritime , Intersil Corporation , L 3 Communications Corporation , Mmi Amd , National Semiconductor Corp , Philips Semiconductors Inc

ASAP Aerospace, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Customers can easily search our database to find NSN parts like Microcircuit Memory 21676-02, DM54S573J 883B, HM1-7643-8, MM5353-1D 883B, MM5353D 883B of L 3 Communications Corporation, National Semiconductor Corp, Intersil Corporation, Mmi Amd, Dla Land And Maritime with NSN 5962-01-139-3212.

NSN 5962-01-139-3212, National Stock Number, is a 13-digit serial number assigned by the US DLA to an item that is bought, stored, and sold via the federal supply chain. Unlike part numbers, NSNs are not arbitrary and follow a specific classification system.

Part Number List for NSN 5962011393212

Part No	Item Name	Manufacturer	QTY	RFQ
21676-02	Microcircuit Memory	L 3 Communications Corporation	Avl	RFQ
DM54S573J 883B	Microcircuit Memory	National Semiconductor Corp	Avl	RFQ
HM1-7643-8	Microcircuit Memory	Intersil Corporation	Avl	RFQ
MM5353-1D 883B	Microcircuit Memory	Mmi Amd	Avl	RFQ
MM5353D 883B	Microcircuit Memory	Mmi Amd	Avl	RFQ
ROM PROM FAMILY 030	Microcircuit Memory	Dla Land And Maritime	Avl	RFQ
S82S137F 883B	Microcircuit Memory	Philips Semiconductors Inc	Avl	RFQ
S82S137I 883B	Microcircuit Memory	Philips Semiconductors Inc	Avl	RFQ

Characteristics Data of NSN 5962011393212

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.925 INCHES MAXIMUM
ADAT	BODY WIDTH	0.302 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.175 INCHES MAXIMUM
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	12 INPUT
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZER	MEMORY DEVICE TYPE	ROM
CZZZ	MEMORY CAPACITY	UNKNOWN
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQY	TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT

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