NSN 5962-01-173-7145 (5962011737145) Microcircuit Memory Parts List

Alternative NSN: 5962-01-173-7145

FSG: 59 Electrical and Electronic Equipment Components

Federal Supply Class (FSC): 5962 Microcircuits Electronic

NCB Code: USA (01)

Manufacturers: Advanced Micro Devices Inc , Datametrics Corporation , Dla Land And Maritime , Fairchild Semiconductor Corporation , Intel Corporation , Intersil Corporation , Mmi Amd , Philips Semiconductors Inc , Rugged Information Technology

ASAP Aerospace, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Customers can easily search our database to find NSN parts like Microcircuit Memory 108626, 108626, 5301-1, 82S129, 93427 of Rugged Information Technology, Datametrics Corporation, Mmi Amd, Philips Semiconductors Inc, Fairchild Semiconductor Corporation with NSN 5962-01-173-7145.

NSN 5962-01-173-7145, National Stock Number, is a 13-digit serial number assigned by the US DLA to an item that is bought, stored, and sold via the federal supply chain. Unlike part numbers, NSNs are not arbitrary and follow a specific classification system.

Part Number List for NSN 5962011737145

Part No	Item Name	Manufacturer	QTY	RFQ
108626	Microcircuit Memory	Rugged Information Technology	Avl	RFQ
108626	Microcircuit Memory	Datametrics Corporation	Avl	RFQ
5301-1	Microcircuit Memory	Mmi Amd	Avl	RFQ
82S129	Microcircuit Memory	Philips Semiconductors Inc	Avl	RFQ
93427	Microcircuit Memory	Fairchild Semiconductor Corporation	Avl	RFQ
AM27S11	Microcircuit Memory	Advanced Micro Devices Inc	Avl	RFQ
HM7611	Microcircuit Memory	Intersil Corporation	Avl	RFQ
IM5623	Microcircuit Memory	Intersil Corporation	Avl	RFQ
M3621	Microcircuit Memory	Intel Corporation	Avl	RFQ
ROM PROM FAMILY 005	Microcircuit Memory	Dla Land And Maritime	Avl	RFQ

Characteristics Data of NSN 5962011737145

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM
ADAT	BODY WIDTH	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
ADAU	BODY HEIGHT	0.140 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	307.2 MILLIWATTS
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQWX	OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
CQZP	INPUT CIRCUIT PATTERN	10 INPUT
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CZEQ	TIME RATING PER CHACTERISTIC	75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
CZER	MEMORY DEVICE TYPE	ROM
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TTQY	TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT

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