GF00000975 Part with NSN 5962013065559 by Bae Systems Inc - Buy Now

Part Number:  GF00000975
Manufacturer:  Bae Systems Inc
Item Name :  microcircuit memory
CAGE Code:  K0978
NIIN:  01-306-5559
INC Code:  41015
Country:  USA
NCB Code:  01

Thank you for taking an interest in Bae Systems Inc part number GF00000975, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number GF00000975, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number GF00000975 Details: 

Part number GF00000975 traces back to Bae Systems Inc (CAGE Code K0978), having been classified under NSN 5962013065559 and item name Microcircuit Memory. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic. Additional listing data derived from the NSN includes the NIIN 013065559, the INC 41015, and NCB code 01 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number GF00000975 with NSN 5962-01-306-5559, 5962013065559

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-306-5559

Item PartTypeName:

MICROCIRCUIT,MEMORY

59620130655590ND
CIICHCCESDPMICCriticalityENAC
UDA0
Part NumberISCRNVCRNCCHCCMSDSSADC
28721-1600-0016595

Characteristics Data of NSN 5962-01-306-5559, 5962013065559

MRCCriteriaCharacteristic
ABHPOVERALL LENGTH1.280 INCHES MAXIMUM
ABKWOVERALL HEIGHT0.400 INCHES MAXIMUM
ABMKOVERALL WIDTH0.320 INCHES MAXIMUM
ADAQBODY LENGTH32.51 MILLIMETERS MAXIMUM
ADATBODY WIDTH4.40 MILLIMETERS MAXIMUM
ADAUBODY HEIGHT5.59 MILLIMETERS MINIMUM AND 7.87 MILLIMETERS MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING1.0 WATTS
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDBURN IN AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
CQSJINCLOSURE MATERIALCERAMIC
CQSZINCLOSURE CONFIGURATIONDUAL-IN-LINE
CQWXOUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQZPINPUT CIRCUIT PATTERN15 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
CTQXCURRENT RATING PER CHARACTERISTIC120.00 MILLIAMPERES MAXIMUM SUPPLY
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
CZERMEMORY DEVICE TYPEEPROM
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
TTQYTERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT

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