MHQ2222 Part with NSN 5961002757576 by Bi Technologies Corporation - Buy Now

Part Number:  MHQ2222
Manufacturer:  Bi Technologies Corporation
Item Name :  semiconductor devic
CAGE Code:  73138
NIIN:  00-275-7576
INC Code:  61962
Country:  USA
NCB Code:  00

Thank you for taking an interest in Bi Technologies Corporation part number MHQ2222, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number MHQ2222, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number MHQ2222 Details: 

Part number MHQ2222 traces back to Bi Technologies Corporation (CAGE Code 73138), having been classified under NSN 5961002757576 and item name Semiconductor Devic. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5961 Semiconductor Devices and Associated Hardware. Additional listing data derived from the NSN includes the NIIN 002757576, the INC 61962, and NCB code 00 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number MHQ2222 with NSN 5961-00-275-7576, 5961002757576

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5961-00-275-7576

Item PartTypeName:

SEMICONDUCTOR DEVICES,UNITIZED

59610027575760NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
1858-007395

Characteristics Data of NSN 5961-00-275-7576, 5961002757576

MRCCriteriaCharacteristic
ABBHINCLOSURE MATERIALCERAMIC
ABHPOVERALL LENGTH0.785 INCHES MAXIMUM
ABJTTERMINAL LENGTH0.120 INCHES MINIMUM
ABKWOVERALL HEIGHT0.280 INCHES MAXIMUM
ABMKOVERALL WIDTH0.300 INCHES NOMINAL
ALAZJOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATIONTO-116
ALBAELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASECOLLECTOR
ASKACOMPONENT NAME AND QUANTITY4 TRANSISTOR
AXGYMOUNTING METHODTERMINAL
CBBLFEATURES PROVIDEDHERMETICALLY SEALED CASE
CRTLCRITICALITY CODE JUSTIFICATIONFEAT
CTMZSEMICONDUCTOR MATERIALSILICON ALL TRANSISTOR
CTQNVOLTAGE RATING IN VOLTS PER CHARACTERISTIC60.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN ALL TRANSISTOR AND 40.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN ALL TRANSISTOR AND 5.0 MAXIMUM BREAKDOWN VOLTAGE,EMITTER-TO-BASE,COLLECTOR OPEN ALL TRANSISTOR
CTQXCURRENT RATING PER CHARACTERISTIC0.50 AMPERES MAXIMUM COLLECTOR CURRENT,DC ALL TRANSISTOR
CTRDPOWER RATING PER CHARACTERISTIC1900.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL TRANSISTOR
CTSGMAXIMUM OPERATING TEMP PER MEASUREMENT POINT200.0 DEG CELSIUS JUNCTION
FEATSPECIAL FEATURESDESIGN ANALYSIS TRANSISTOR JUNCTION PATTERN ARRANGEMENT NPN
NHCFNUCLEAR HARDNESS CRITICAL FEATUREHARDENED
TTQYTERMINAL TYPE AND QUANTITY14 PIN

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