53S3281BW883B Part with NSN 5962013320723 by Mmi Amd - Buy Now

Part Number:  53S3281BW883B
Manufacturer:  Mmi Amd
Item Name :  microcircuit memory
CAGE Code:  50364
NIIN:  01-332-0723
INC Code:  41015
Country:  USA
NCB Code:  01

Thank you for taking an interest in Mmi Amd part number 53S3281BW883B, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number 53S3281BW883B, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number 53S3281BW883B Details: 

Part number 53S3281BW883B traces back to Mmi Amd (CAGE Code 50364), having been classified under NSN 5962013320723 and item name Microcircuit Memory. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic. Additional listing data derived from the NSN includes the NIIN 013320723, the INC 41015, and NCB code 01 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number 53S3281BW883B with NSN 5962-01-332-0723, 5962013320723

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-332-0723

Item PartTypeName:

MICROCIRCUIT,MEMORY

59620133207230NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
53S3281BW883B295

Characteristics Data of NSN 5962-01-332-0723, 5962013320723

MRCCriteriaCharacteristic
ADATBODY WIDTH0.404 INCHES MINIMUM AND 0.420 INCHES MAXIMUM
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE
CQSJINCLOSURE MATERIALCERAMIC
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS MAXIMUM POWER SOURCE
CZERMEMORY DEVICE TYPEROM
ABMKOVERALL WIDTH0.720 INCHES MAXIMUM
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CQSZINCLOSURE CONFIGURATIONFLAT PACK
CQZPINPUT CIRCUIT PATTERN14 INPUT
TTQYTERMINAL TYPE AND QUANTITY24 FLAT LEADS
ADAQBODY LENGTH0.595 INCHES MINIMUM AND 0.630 INCHES MAXIMUM
ADAUBODY HEIGHT0.060 INCHES MINIMUM AND 0.090 INCHES MAXIMUM
CQWXOUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZEQTIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).

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