PAL16L2MJ 883 Part with NSN 5962013410366 by Mmi Amd - Buy Now

Part Number:  PAL16L2MJ 883
Manufacturer:  Mmi Amd
Item Name :  microcircuit memory
CAGE Code:  50364
NIIN:  01-341-0366
INC Code:  41015
Country:  USA
NCB Code:  01

Thank you for taking an interest in Mmi Amd part number PAL16L2MJ 883, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number PAL16L2MJ 883, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number PAL16L2MJ 883 Details: 

Part number PAL16L2MJ 883 traces back to Mmi Amd (CAGE Code 50364), having been classified under NSN 5962013410366 and item name Microcircuit Memory. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic. Additional listing data derived from the NSN includes the NIIN 013410366, the INC 41015, and NCB code 01 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number PAL16L2MJ 883 with NSN 5962-01-341-0366, 5962013410366

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-341-0366

Item PartTypeName:

MICROCIRCUIT,MEMORY

59620134103660NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
716077-003293

Characteristics Data of NSN 5962-01-341-0366, 5962013410366

MRCCriteriaCharacteristic
ADAQBODY LENGTH1.280 INCHES MAXIMUM
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND BIPOLAR
CQSJINCLOSURE MATERIALCERAMIC
CQZPINPUT CIRCUIT PATTERN16 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-500.0 MILLIVOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT
CZERMEMORY DEVICE TYPEPROGRAMMED
CQWXOUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
CTQXCURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES NOMINAL OUTPUT SINK
CWSGTERMINAL SURFACE TREATMENTSOLDER
ADATBODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
ABKWOVERALL HEIGHT0.400 INCHES MAXIMUM
ADAUBODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
CQSZINCLOSURE CONFIGURATIONDUAL-IN-LINE
CXCYPART NAME ASSIGNED BY CONTROLLING AGENCYAND-OR INVERT GATE ARRAY
TTQYTERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT

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