UPD2167 Part with NSN 5962012678169 by Nec Electronics U S A Inc - Buy Now

Part Number:  UPD2167
Manufacturer:  Nec Electronics U S A Inc
Item Name :  microcircuit memory
CAGE Code:  4T165
NIIN:  01-267-8169
INC Code:  41015
Country:  USA
NCB Code:  01

Thank you for taking an interest in Nec Electronics U S A Inc part number UPD2167, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number UPD2167, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number UPD2167 Details: 

Part number UPD2167 traces back to Nec Electronics U S A Inc (CAGE Code 4T165), having been classified under NSN 5962012678169 and item name Microcircuit Memory. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic. Additional listing data derived from the NSN includes the NIIN 012678169, the INC 41015, and NCB code 01 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number UPD2167 with NSN 5962-01-267-8169, 5962012678169

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-267-8169

Item PartTypeName:

MICROCIRCUIT,MEMORY

59620126781690NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
CY7C167-55515

Characteristics Data of NSN 5962-01-267-8169, 5962012678169

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.425 INCHES NOMINAL
ADATBODY WIDTH0.290 INCHES NOMINAL
ADAUBODY HEIGHT0.065 INCHES NOMINAL
AEHXMAXIMUM POWER DISSIPATION RATING1.0 WATTS
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE
CQSJINCLOSURE MATERIALCERAMIC
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CQWXOUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQZPINPUT CIRCUIT PATTERN17 INPUT
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPERAM
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
TTQYTERMINAL TYPE AND QUANTITY20 LEADLESS

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