WS27C512L-20CMB Part with NSN 5962013332528 by Waferscale Integration Inc - Buy Now

Part Number:  WS27C512L-20CMB
Alternate P/N:  WS27C512L20CMB
Manufacturer:  Waferscale Integration Inc
Item Name :  microcircuit memory
CAGE Code:  66579
NIIN:  01-333-2528
INC Code:  41015
Country:  USA
NCB Code:  01

Thank you for taking an interest in Waferscale Integration Inc part number WS27C512L-20CMB, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number WS27C512L-20CMB, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number WS27C512L-20CMB Details: 

Part number WS27C512L-20CMB traces back to Waferscale Integration Inc (CAGE Code 66579), having been classified under NSN 5962013332528 and item name Microcircuit Memory. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic. Additional listing data derived from the NSN includes the NIIN 013332528, the INC 41015, and NCB code 01 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number WS27C512L-20CMB with NSN 5962-01-333-2528, 5962013332528

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-333-2528

Item PartTypeName:

MICROCIRCUIT,MEMORY

59620133325280ND
CIICHCCESDPMICCriticalityENAC
7DA0
Part NumberISCRNVCRNCCHCCMSDSSADC
5962-8764802YB395

Characteristics Data of NSN 5962-01-333-2528, 5962013332528

MRCCriteriaCharacteristic
ADATBODY WIDTH0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CTFTCASE OUTLINE SOURCE AND DESIGNATORC-12 MIL-M-38510
CTQXCURRENT RATING PER CHARACTERISTIC60.00 MILLIAMPERES MAXIMUM SUPPLY
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
CQSJINCLOSURE MATERIALCERAMIC
CQWXOUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
ADAQBODY LENGTH0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
ADAUBODY HEIGHT0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZEQTIME RATING PER CHACTERISTIC200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
TTQYTERMINAL TYPE AND QUANTITY32 LEADLESS
AEHXMAXIMUM POWER DISSIPATION RATING350.0 MILLIWATTS
CQZPINPUT CIRCUIT PATTERN26 INPUT
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
CZERMEMORY DEVICE TYPEEPROM

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