PAL 6L88B-4ML 883B Part with NSN 5962013601550 by Mmi Amd - Buy Now

Part Number:  PAL 6L88B-4ML 883B
Alternate P/N:  PAL6L88B4ML883B
Manufacturer:  Mmi Amd
Item Name :  microcircuit memory
CAGE Code:  50364
NIIN:  01-360-1550
INC Code:  41015
Country:  USA
NCB Code:  01

Thank you for taking an interest in Mmi Amd part number PAL 6L88B-4ML 883B, which is currently available for purchase today here on ASAP Aerospace. You have reached our Request for Quote (RFQ) page for this part number PAL 6L88B-4ML 883B, where we make it easy to secure competitive pricing and procurement options from our staff.

Part Number PAL 6L88B-4ML 883B Details: 

Part number PAL 6L88B-4ML 883B traces back to Mmi Amd (CAGE Code 50364), having been classified under NSN 5962013601550 and item name Microcircuit Memory. With its NSN, this part number belongs to FSG 59 Electrical and Electronic Equipment Components and FSC 5962 Microcircuits Electronic. Additional listing data derived from the NSN includes the NIIN 013601550, the INC 41015, and NCB code 01 (USA).

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx. All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number PAL 6L88B-4ML 883B with NSN 5962-01-360-1550, 5962013601550

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-360-1550

Item PartTypeName:

MICROCIRCUIT,MEMORY

59620136015500ND
CIICHCCESDPMICCriticalityENAC
7DA0
Part NumberISCRNVCRNCCHCCMSDSSADC
PAL/6L88B-4ML/883B595

Characteristics Data of NSN 5962-01-360-1550, 5962013601550

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.358 INCHES MAXIMUM
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
CBBLFEATURES PROVIDEDBURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
CQSJINCLOSURE MATERIALCERAMIC
CQWXOUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
CQZPINPUT CIRCUIT PATTERN16 INPUT
CTQXCURRENT RATING PER CHARACTERISTIC1.00 MILLIAMPERES MAXIMUM INPUT
CXCYPART NAME ASSIGNED BY CONTROLLING AGENCYMICROCIRCUITS,DIGITAL,BIPOLAR,PROGRAMMABLE LOGIC,MONOLITHIC SILICON
ADATBODY WIDTH0.310 INCHES MAXIMUM
ADAUBODY HEIGHT0.100 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING303.0 MILLIWATTS
CTFTCASE OUTLINE SOURCE AND DESIGNATORC-2 MIL-M-38510
AFJQSTORAGE TEMP RANGE-65.0 TO 150.0 DEG CELSIUS
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
TTQYTERMINAL TYPE AND QUANTITY20 LEADLESS
CQSZINCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CZERMEMORY DEVICE TYPEPAL

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